Tail Solder Dip Termination

For customers that choose PC tail terminations, FilConn can solder dip the solderable area of the PC tail leads. The solder dip process reduces the occurrence of gold embrittlerment and also allows for easier soldering at the circuit level. For customers that require tight solder dip tolerances, FilConn can incorporate special fixturing technology to meet these tight tolerances. Typical solder used during this process is SN 63/PB37 however for specific requirements FilConn can incorporate any solder type or alloy per the customers requirements.